Delip "Doug" Bokil is our Managing Partner.

His work experience includes working with small, medium and large size companies in the Information Technology and Industrial sectors.

His international experience involves setting up a factory in China and several manufacturing facilities in India, China and the Philippines and trouble-shooting processes and resolving DFM / T issues in Ireland, Hong Kong, China, U.K., Portugal, Italy, Mexico and the Philippines.

EDUCATION:

Master of Science, Management, Northeastern University, Boston, MA

Bachelor of Technology Electronics and Communications, Indian Institute of Technology, Kharagpur, India

Technology Manager's Program, Babson College, Wellesley, MA

Certified Quality Engineer (ASQ)

Keywords (in alphabetical order)

Adhesives, analysis, AOI, automatic optical inspection, BAR97, budgeting, capital equipment, casting, ceramics, certified quality engineer, cleaning, communication, DFM, DFT, dynamometer, electronics, emissions testing, entrepreneurial training, epoxy, factory, failure analysis, final assembly, FMECA, hermetic sealing, hybrids, ISO, laser, localization, maintenance, manager, manufacturing, MCM, moisture gettering, molding, MS management, NC flux, NDIR, NDUV, NPI, organic substrate, out sourcing, PAU, PCB potting, process development, process engineering, procuring, reflow, seam sealing, senior engineer, sensors, silicone, Six Sigma, SMT, solder, SPC, specifying, supervisor, team leader, technology manager's program, thermal analysis, training, YAG-CO laser, zero air generator.

Summary of Qualifications

• Supported Auto Emissions test lanes in Beijing, China and Mexico-D.F.

• Extensive experience as Senior Engineer and Manager in manufacturing environment.

• Success in managing process engineering department and new product development.

• Performed all aspects of budgeting, specifying, and procuring capital equipment.

• Established SMT manufacturing lines in the Philippines, India and China.

• Trained engineers in Automatic Optical Inspection (AOI).

• Served as member of ISO-9000 audit committees.

AWARDS-ACCOMPLISHMENTS:

• President-Elect 2008, International Microelectronics & Packaging Society (IMAPS)

• Gen. Chair, IMAPS-2003 International Symposium in Boston.

• “Application of Sensors in Automotive Emissions Testing” presented at IMAPS-2003.

• " Product of the Year " award from Electronics Products magazine.

• " Best Paper of the Session " award from IMAPS. Two " Technical Excellence " awards from RCA.

• “ FIM plates temper converter heat “ EE Times

• Two patents for a thick-film high voltage transformer and an infrared glass sealing process.

• Editor: IMAPS Journal of Microelectronics and Electronic Packaging

PROFESSIONAL AFFILIATIONS

IMAPS, SMTA, IEEE, ASQ

PERSONAL

US Citizen, Secret clearance

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